Tiep is a Patent Engineer at Ofinno with a research background in wireless communications. Prior to joining the company, his work primarily focused on physical layer security and authentication, reconfigurable intelligent surfaces, and the applications of convex optimization and AI/machine learning in wireless networks.
His experience includes several years as a postdoctoral researcher at the Rochester Institute of Technology (US), the University of Colorado Denver (US), and the University of Southampton (UK). Tiep earned his Ph.D. in Electronics, Electrical Engineering, and Computer Science from Queen’s University Belfast (UK) in 2019.